Device for pressure bonding an integrated circuit to a...

Details Device for pressure bonding an integrated circuit to a... Device for pressure bonding an integrated circuit to a...

2005-12-27

2005-12-27

Flynn, Nathan J. (Department: 2826)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S741000, C029S840000, C257S778000

Reexamination Certificate

active

06978534

ABSTRACT:
A pressure device for pressure bonding an IC chip on a circuit board includes an IC pressurizing member having a groove extending in a predetermined direction, and formed on a surface opposite to a surface abutting the IC chip. A columnar member is provided overlapped on the IC pressurizing member so as to bring an external surface thereof into contact within the groove of the IC pressurizing member. A pressure receiving member has a groove extending in a predetermined direction and overlapped on the IC pressurizing member so as to bring an external surface of the columnar member into contact within the groove thereof. An adjusting member adjusts parallelism between the IC pressurizing member and the pressure receiving member, and a fixing member fixes a relative position between the IC pressurizing member and the pressure receiving member.

REFERENCES:
patent: 5115545 (1992-05-01), Fujimoto et al.
patent: 6269999 (2001-08-01), Okazaki et al.
patent: 6559523 (2003-05-01), Schmid et al.
patent: 2000-68633 (2000-03-01), None

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