Filling plugs through chemical mechanical polish

Details Filling plugs through chemical mechanical polish Filling plugs through chemical mechanical polish

2005-11-29

2005-11-29

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S041000, C451S286000, C451S287000, C451S288000, C438S632000, C438S633000, C438S646000, C438S650000, C438S687000

Reexamination Certificate

active

06969301

ABSTRACT:
A scheme for filling plugs through chemical mechanical polishing comprises depositing a malleable conductive layer over a dielectric layer having openings formed therein. The malleable conductive layer is deposited such that a liner is formed within the openings, however the openings are not completely filled. A chemical mechanical polishing process using an alumina based slurry at a neutral or slightly basic pH and no oxidizer is used to smear the malleable conductive layer sufficiently to fill the remainder of the openings in the dielectric layer forming filled or substantially filled plugs.

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M. Hauder et al.; Chemical Mechanical Polishing of Silver Damascene Structures; Microelectronic Engineering, 64 (2002) 73-79.

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