Method for manufacturing and packaging integrated circuit

Details Method for manufacturing and packaging integrated circuit Method for manufacturing and packaging integrated circuit

2005-06-21

2005-06-21

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S827000, C029S841000, C029S842000, C029S845000, C029S874000, C029S884000, C174S050510, C257S676000, C257S696000

Reexamination Certificate

active

06907659

ABSTRACT:
A method for manufacturing and packaging an integrated circuit includes following steps: pressure a continuous pin material and a base board area at first; then cut off pin material into several pin units, accommodate each pin units into respective position in a mould, and ejecting plastic into the mould gap to shape a pin unit, then remove waste part of the pin material after removing down the mould parts; put four pin units and a base board into a rectangle mould, then eject plastic again into mould gap, after that cut off waste part of the base board to attain an IC socket; stick an IC chip on top of the base board of the IC socket and wire it. Finally, cover and stick a panel on the IC socket to finish the whole IC packaging procedures.

REFERENCES:
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4330683 (1982-05-01), Parker
patent: 5152057 (1992-10-01), Murphy
patent: 5819403 (1998-10-01), Crane et al.

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