Semiconductor device and method of manufacturing same

Details Semiconductor device and method of manufacturing same Semiconductor device and method of manufacturing same

2005-06-14

2005-06-14

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S108000, C438S109000, C257S777000, C257S779000, C257S778000, C257S784000, C257S795000

Reexamination Certificate

active

06905913

ABSTRACT:
A method of manufacturing a semiconductor device includes providing first pad electrodes for connection to leads and second pad electrodes for an internal interface, over a main surface of a first LSI chip. Third pad electrodes of a second LSI chip and the second pad electrodes of the first LSI chip are respectively electrically connected to one another by wires. Circuits required as for a system LSI, which are not included in the first LSI chip, are placed over the second LSI chip, to implement a desired function used as for a system LSI by the two LSI chips. The plurality of LSI chips are then sealed with a resin.

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