Thin-film deposition method

Details Thin-film deposition method Thin-film deposition method

2005-08-23

2005-08-23

Chen, Bret (Department: 1762)

Coating processes

Coating by vapor, gas, or smoke

C427S569000, C427S058000, C427S294000

Reexamination Certificate

active

06933009

ABSTRACT:
In a thin-film deposition method, a substrate is placed in a heat chamber having a pressure equal to or higher than an atmospheric pressure, and the substrate is heated in the heat chamber by supplying gas having a temperature higher than a room temperature by forced convection. The heated substrate is transferred from the heat chamber into a deposition chamber which is a vacuum chamber connected to the heat chamber directly or indirectly with a valve interposed therebetween. Then, a thin-film deposition is carried out on the substrate in the deposition chamber at a deposition temperature higher than the room temperature.

REFERENCES:
patent: 4109157 (1978-08-01), Tanaka et al.
patent: 05-295551 (1993-11-01), None
patent: 11-118356 (1999-04-01), None

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