Server blade modular chassis mechanical and thermal design

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S695000, C361S727000, C312S223100, C312S223200

Reexamination Certificate

active

06927975

ABSTRACT:
A method and system for packaging a computer system is disclosed. The computer system is capable of including a plurality of blades, a first plurality of devices, and a second plurality of devices. The method and system include providing a chassis having a first cavity, a first plenum, a second plenum and a common plenum therein. The first cavity retains the blades in parallel. The chassis is configured such that air sufficient to cool the blades is drawn into the chassis and through the blades. The first plenum is configured such that a first portion of the air sufficient to cool the first plurality of devices is drawn from the blades into the first plenum, through the first plurality of devices and into the common plenum. The second plenum is configured in an analogous manner for the second plurality of devices. The common plenum is configured such that a remaining portion of the air from the blades is drawn into the common plenum, and such that the first and second portions of the air are received into the common plenum from the first and second plurality of devices, respectively.

REFERENCES:
patent: 4860163 (1989-08-01), Sarath
patent: 5420750 (1995-05-01), Freige et al.
patent: 5663868 (1997-09-01), Stalley
patent: 6000464 (1999-12-01), Scafidi et al.
patent: 6011688 (2000-01-01), Thornburg et al.
patent: 6163454 (2000-12-01), Strickler
patent: 6496366 (2002-12-01), Coglitore et al.
patent: 6778386 (2004-08-01), Garnett et al.
patent: 2002/0126449 (2002-09-01), Casebolt
patent: 2002/0191376 (2002-12-01), Ota et al.
patent: 2003/0002254 (2003-01-01), Faneuf et al.
patent: 2003/0030978 (2003-02-01), Garnett et al.
patent: 2003/0053293 (2003-03-01), Beitelmal et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Server blade modular chassis mechanical and thermal design does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Server blade modular chassis mechanical and thermal design, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Server blade modular chassis mechanical and thermal design will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3517521

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.