Substrate plating method and apparatus

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Reexamination Certificate

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Details

C118S423000, C118S429000

Reexamination Certificate

active

06908534

ABSTRACT:
A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a wafer W having fine pits (10) to fill the fine pits with a metal (13) and includes performing a first plating process (11) by immersing the wafer in a first plating solution having a composition superior in throwing power; and performing a second plating process (12) by immersing the substrate in a second plating solution having a composition superior in leveling ability.

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Translation of JP 5-140795 (Jun. 1993).
Translation of JP 62-276893 (Dec. 1987).
Translation of JP 53-53527 (May 1978).
Translation of JP 53-143971 (Dec. 1978).
Translation of JP 07-41991 (Feb. 1995).

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