Method of fabricating printed circuit board with mixed...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S830000, C029S831000, C029S846000, C029S852000, C174S255000, C174S257000, C174S259000, C174S266000, C257S737000, C361S772000, C361S777000

Reexamination Certificate

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06931722

ABSTRACT:
A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

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