Semiconductor device, semiconductor module and hard disk

Details Semiconductor device, semiconductor module and hard disk Semiconductor device, semiconductor module and hard disk

2005-11-22

2005-11-22

Thomas, Tom (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S676000, C257S709000, C257S712000, C257S720000, C438S122000

Reexamination Certificate

active

06967401

ABSTRACT:
A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

REFERENCES:
patent: 5352926 (1994-10-01), Andrews
patent: 5414299 (1995-05-01), Wang et al.
patent: 5543663 (1996-08-01), Takubo
patent: 5557150 (1996-09-01), Variot et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5731631 (1998-03-01), Yama et al.
patent: 5786628 (1998-07-01), Beilstein, Jr. et al.
patent: 5814894 (1998-09-01), Igarashi et al.
patent: 5869894 (1999-02-01), Degani et al.
patent: 5933709 (1999-08-01), Chun
patent: 5969426 (1999-10-01), Baba et al.
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6201292 (2001-03-01), Yagi et al.
patent: 6404049 (2002-06-01), Shibamoto et al.
patent: 19532755 (1997-02-01), None
patent: 9312355 (1997-12-01), None
patent: 10308478 (1998-11-01), None
patent: 11-110926 (1999-04-01), None
patent: 11195730 (1999-07-01), None
patent: 11260985 (1999-09-01), None
Nikkei Electronics; No. 691, Jun. 16, 1997. pp. 92-120.

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