Temperature sustaining flip chip assembly process

Details Temperature sustaining flip chip assembly process Temperature sustaining flip chip assembly process

Filed on

2005-06-07

Date issued

2005-06-07

Examiner

Thai, Luan (Department: 2829)

Patent Class

Semiconductor device manufacturing: process

SubClass

Packaging or treatment of packaged semiconductor

SubSubClass

Assembly of plural semiconductive substrates each possessing...

Other Related Categories

C438S612000, C438S613000

Type

Reexamination Certificate

Status

active

Patent number

06902954

Description

ABSTRACT:
A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during flip chip packaging.

REFERENCES:
patent: 6489180 (2002-12-01), Tsai et al.
patent: 2003/0096453 (2003-05-01), Wang et al.

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