System and method for dissipating heat from an electronic board

Details System and method for dissipating heat from an electronic board System and method for dissipating heat from an electronic board

2005-11-22

2005-11-22

Feild, Lynn (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C165S080300, C257S712000

Reexamination Certificate

active

06967843

ABSTRACT:
Disclosed is an electronic board comprising a plurality of individual devices, each device having a plurality of connectors, the connectors mated to receptacles on the board, and a heat dissipating cover connected to the board and forming a cavity incarcerating the plurality of devices, the cover thermally contacting a plurality of the individual devices, the cover having a dimensional pattern such that its outer surface area is greater than its planar area.

REFERENCES:
patent: 3167322 (1965-01-01), Aichroth
patent: 4092697 (1978-05-01), Spaight
patent: 6016006 (2000-01-01), Kolman et al.
patent: 6175501 (2001-01-01), Bortolini et al.
patent: 6424532 (2002-07-01), Kawamura
patent: 6462271 (2002-10-01), Coffin et al.
patent: 6552906 (2003-04-01), Kanada
patent: 6625025 (2003-09-01), Duxbury et al.
www.aavidthermalloy.com, AAVID Thermalloy, “Heat Sinks for Memory”, Cool-Covers™.

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