Method of forming an electronic component using ink

Details Method of forming an electronic component using ink Method of forming an electronic component using ink

2005-12-27

2005-12-27

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S514000, C174S257000

Reexamination Certificate

active

06979416

ABSTRACT:
A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 μm or more to 10 μm or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less.

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