Process of producing diamond composite structure for electronic

Details Process of producing diamond composite structure for electronic Process of producing diamond composite structure for electronic

1995-05-02

1996-06-11

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

117929, 257 77, H01L 2120, C30B 2904

Patent

active

055255370

ABSTRACT:
The invention relates to a composite structure for electronic components comprising a growth substrate, an intermediate layer having substantially a crystallographic lattice structure arranged on the growth substrate, and a diamond layer applied on top of the intermediate layer, and to a process for producing a composite structure of this type. In order to obtain a diamond layer of highest quality, the intermediate layer has substantially a zinc blende or diamond or a calcium fluoride structure, in which at the outset of the intermediate layer the difference between the lattice constant of the intermediate layer and the lattice constant of the growth substrate, relative to the lattice constant of the growth substrate, is less than 20%, in particular less than 10%, and in which at the transition from the intermediate layer to the diamond layer for the lattice constant of the intermediate layer and the lattice constant of the diamond layer the value of the expression

REFERENCES:
patent: 5006203 (1991-04-01), Purdes
patent: 5034784 (1991-07-01), Yamazaki
patent: 5173761 (1992-12-01), Dreifus et al.
patent: 5243199 (1993-09-01), Shiomi et al.
patent: 5252840 (1993-10-01), Shiomi et al.
patent: 5254862 (1993-10-01), Das et al.

Affiliated with

Also associated with

Rating

Process of producing diamond composite structure for electronic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of producing diamond composite structure for electronic , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of producing diamond composite structure for electronic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-351349