Semiconductor device and method of manufacture thereof,...

Details Semiconductor device and method of manufacture thereof,... Semiconductor device and method of manufacture thereof,...

2005-12-06

2005-12-06

Nelms, David (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S262000, C174S050510, C361S760000, C361S777000, C257S778000, C257S738000

Reexamination Certificate

active

06972381

ABSTRACT:
A semiconductor device and a method of manufacturing the semiconductor device includes: a first step of interposing a thermosetting anisotropic conductive material16between a substrate12and a semiconductor chip20; a second step in which pressure and heat are applied between the semiconductor chip20and the substrate12, an interconnect pattern10and electrodes22are electrically connected, and the anisotropic conductive material16is spreading out beyond the semiconductor chip20and is cured in the region of contact with the semiconductor chip20; and a third step in which the region of the anisotropic conductive material16other than the region of contact with the semiconductor chip20is heated.

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