Pulsed processing semiconductor heating methods using...

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Reexamination Certificate

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C219S405000, C219S411000, C392S416000, C392S418000, C118S724000, C118S050100, C438S005000, C438S486000, C438S166000, C438S928000

Reexamination Certificate

active

06849831

ABSTRACT:
Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.

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