Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2005-06-21
2005-06-21
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S735000, C257S736000, C257S737000
Reexamination Certificate
active
06909180
ABSTRACT:
The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.
REFERENCES:
patent: 5461197 (1995-10-01), Hiruta et al.
patent: 5622590 (1997-04-01), Kunitomo et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5844320 (1998-12-01), Ono et al.
patent: 6137184 (2000-10-01), Ikegami
patent: 6137185 (2000-10-01), Ishino et al.
patent: 6214446 (2001-04-01), Funada et al.
patent: 6261941 (2001-07-01), Li et al.
patent: 6452280 (2002-09-01), Shiraishi et al.
patent: 4-260358 (1992-09-01), None
patent: 8-37206 (1996-02-01), None
patent: 8-120228 (1996-05-01), None
patent: 9-27516 (1997-01-01), None
patent: 10-199932 (1998-07-01), None
patent: 11-251368 (1999-09-01), None
Ono Masahiro
Shiraishi Tsukasa
Ha Nathan W.
Pham Long
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Semiconductor device, mounting circuit board, method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, mounting circuit board, method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, mounting circuit board, method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3512029