Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-12-27
2005-12-27
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S691000, C257S773000, C257S774000, C257S778000, C257S784000, C257S775000, C257S738000, C257S780000, C257S737000
Reexamination Certificate
active
06979898
ABSTRACT:
A semiconductor component and a method for fabricating semiconductor components such as printed circuit boards, multi chip modules, chip scale packages, and test carriers is provided. The semiconductor component includes providing a substrate having a blanket deposited conductive layer thereon. Using a laser machining process, grooves are formed in the conductive layer to define patterns of conductors on the substrate. The conductors can be formed with a desired size and spacing, and can include features such as bond pads, conductive vias, and external ball contacts. In addition, selected conductors can be configured as co-planar ground or voltage traces, for adjusting impedance values in other conductors configured as signal traces.
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Farnworth Warren M.
Wood Alan G.
Gratton Stephen A.
Parekh Nitin
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