Integrated back-end integrated circuit manufacturing assembly

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S106000

Reexamination Certificate

active

06931298

ABSTRACT:
An integrated back-end integrated circuit (IC) manufacturing assembly is disclosed. In one embodiment, the present invention has a front-of-line portion comprising a plurality of integrated sub-stations for operating on a first plurality of die-strips on an in-line basis to produce a second plurality of die-strips. The present embodiment further comprises an end-of-line portion coupled to the front-of-line portion and comprising a plurality of integrated sub-stations for operating on the second plurality of die-strips on an in-line basis to produce die-strip components. The present embodiment also comprises an in-line test portion coupled to the end-of-line portion for testing the die-strip components. The present embodiment further comprises a finish portion coupled to the in-line test portion and comprising a plurality of integrated sub-stations operating on tested die-strip components. In addition, camera systems perform automated visual inspection of dies on the die-strip and maintain a database that can be used for automated reject management.

REFERENCES:
patent: 4915565 (1990-04-01), Bond et al.
patent: 6045652 (2000-04-01), Tuttle et al.
patent: 6230719 (2001-05-01), Wensel
patent: 6392286 (2002-05-01), Jin et al.
patent: 6549821 (2003-04-01), Farnworth et al.
patent: 6730532 (2004-05-01), Chang et al.
patent: 6730545 (2004-05-01), Chang et al.
T. Olson, “Emerging Package-less Strip Designs Demand Innovative Manufacturing Approaches”, Semiconductor Magazine, vol. 1, Isuue 4, Apr. 2000, P58, 2 Sheets.
L. Estacio, “Cypress Semiconductor Leads the Way with Advance Strip Level Tracking”, Semiconductor Magazine, vol. 1, Issue 4, Apr. 2000, P60, 1 Sheet.
J. Pedro, L. Estacio, “Using Electronic Strip Mapping for Tracking Defects in a Fully Integrated Assembly and Test Line”, 8 Sheets.
C.T. Choon, K.R. Vadivazhagu, N.H. Sieng, :Automation/Integration Program in TAP Reality Vs Vision, Test Assembly & Packaging 1999, 8 Sheets.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated back-end integrated circuit manufacturing assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated back-end integrated circuit manufacturing assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated back-end integrated circuit manufacturing assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3511100

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.