Electronic component with a semiconductor chip and method...

Details Electronic component with a semiconductor chip and method... Electronic component with a semiconductor chip and method...

2005-02-08

2005-02-08

Edmondson, L. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S180100, C228S180210

Reexamination Certificate

active

06851598

ABSTRACT:
An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

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