Connection of a semiconductor component to a metal carrier

Details Connection of a semiconductor component to a metal carrier Connection of a semiconductor component to a metal carrier

1990-05-31

1992-08-11

Hille, Rolf

357 81, 357 67, H01L 2312, H01L 2314

Patent

active

051384280

ABSTRACT:
A reliable connection of a semiconductor component to a metal carrier is provided which avoids damage during bonding. A buffer material is applied between the semiconductor component and the metal carrier. Means are provided for fixing the buffer material during the bonding, such as a roughening of one or both surfaces in contact with the buffer material. Also, the metal carrier has a stiffening structure. Also, a weakening of the metal carrier can serve to increase the flexibility of the metal carrier and prevent damage thereto during bonding.

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patent: 4845543 (1989-07-01), Okikawa et al.
patent: 4872047 (1989-10-01), Fister et al.
patent: 4899210 (1990-02-01), Lorenzetti et al.
patent: 4952999 (1990-08-01), Robinson et al.

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