Space-saving test structures having improved capabilities

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C324S525000, C324S763010, C257S048000

Reexamination Certificate

active

06909293

ABSTRACT:
A space-saving test structure includes a core metal line, at least one extrusion detection line and an extrusion monitoring segment. The core metal line has a “non-linear configuration” and is capable of conducting current for an electromigration test, an isothermal test, and extrusion monitoring. The at least one extrusion detection line is situated adjacent to the core metal line. The extrusion monitoring segment is electrically connected to the at least one extrusion detection line. The extrusion monitoring segment is adapted to determine whether an extrusion occurs in the core metal line by measuring a resistance between the core metal line and the at least one extrusion detection line.

REFERENCES:
patent: 5264377 (1993-11-01), Chesire et al.
patent: 6037795 (2000-03-01), Filippi et al.
patent: 6417572 (2002-07-01), Chidambarrao et al.
patent: 6459153 (2002-10-01), Sengupta
patent: 6680484 (2004-01-01), Young
patent: 6747445 (2004-06-01), Fetterman et al.
patent: 2004/0124865 (2004-07-01), Chuang et al.
“Integrated Test Structure” IBM Technical Disclosure Bulletin, Oct. 1986, vol. 29, Issue 5, pp. 2124-2125.
Arnaud et al., “Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects,” Journal of Applied Physics, New York, US, vol. 93, No. 1, Jan. 1, 2003, pp. 192-204, XP012057647, ISSN: 0021-8979.
Zamani et al., “Chip-Level Electromigration Measurement Technique for MultiSegmented Interconnect Test Structures,” IEEE, Jun. 12, 1989, pp. 198207, XP010092442.
Zamani et al., “Temperature Control in Waferlevel Testing of LargeMulti-segment Electromigration Test Structures,” IEEE Proceedings on Microelectronic Test Structures, Feb. 22, 1988, pp. 138-142, XP010277975.
Anonymous, “Monitor system for electromigration extrusion detection,” Kenneth Mason Publications, Hampshire, GB, vol. 241, No. 41, May 1984, XP007109334, ISSN: 0374-4353.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Space-saving test structures having improved capabilities does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Space-saving test structures having improved capabilities, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Space-saving test structures having improved capabilities will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3506743

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.