Header assembly for optoelectronic devices

Details Header assembly for optoelectronic devices Header assembly for optoelectronic devices

2005-06-28

2005-06-28

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C174S050510, C361S714000, C361S717000

Reexamination Certificate

active

06911599

ABSTRACT:
A header assembly is provided that includes a base having a device side and a connector side. The header assembly further includes a platform attached to the base and positioned in a predetermined orientation with respect to the base. The device side of the base cooperates with a cap to define a hermetic chamber wherein one or more optoelectronic components, such as optical transmitters and optical receivers, are disposed. The platform includes an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform further includes at least one conductive pathway extending substantially through the platform so as to facilitate electrical communication between components disposed on the device side of the base, and circuits, devices and systems disposed on the connector side of the base.

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