Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-08-16
2005-08-16
Eckert, George (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S690000, C257S692000
Reexamination Certificate
active
06930379
ABSTRACT:
An electrical device includes electrical contact pads, a supply voltage bus and an interconnection circuit. The electrical contact pads receive a supply voltage, and the bus is electrically connected to the electrical contact pads. For each electrical contact pad, the interconnection circuit forms a redundant connection between the bus and the electrical contact pad. The electrical device may include a passivation layer that includes windows to establish electrical contact between the electrical contact pads and the supply voltage bus. This window may be elongated in a path that is generally aligned with the path along which the supply voltage bus extends.
REFERENCES:
patent: 5083187 (1992-01-01), Lamson et al.
patent: 5629840 (1997-05-01), Hamburgen et al.
patent: 6396136 (2002-05-01), Kalidas et al.
patent: 6414248 (2002-07-01), Sundstrom
patent: 6538314 (2003-03-01), Buffet et al.
patent: 6657130 (2003-12-01), Van Dyke et al.
Eckert George
Intel Corporation
Ortiz Edgardo
Trop Pruner & Hu P.C.
LandOfFree
Power gridding scheme does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Power gridding scheme, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power gridding scheme will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3505496