Method and system for flip chip packaging

Details Method and system for flip chip packaging Method and system for flip chip packaging

2005-08-23

2005-08-23

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S108000, C438S113000, C438S127000

Reexamination Certificate

active

06933173

ABSTRACT:
According to one embodiment of the invention, a method of packaging flip chips includes providing a plurality of flip chips and a panel, forming a plurality of partitions outwardly from the panel, coupling the flip chips to the panel such that each partition surrounds a respective flip chip, and forming an underfill region between each of the flip chips and the panel. Each partition prevents a respective underfill region from engaging an adjacent underfill region.

REFERENCES:
patent: 6459144 (2002-10-01), Pu et al.
patent: 6696764 (2004-02-01), Honda

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