Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-11-15
2005-11-15
Owens, Douglas W. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S734000, C438S613000, C438S612000
Reexamination Certificate
active
06965164
ABSTRACT:
An electronic device includes a semiconductor substrate in which an integrated circuit is formed; an insulating layer which is formed on the semiconductor substrate and includes an elastically deformable section; an electrode which is electrically connected with inside of the semiconductor substrate and is formed on the elastically deformable section; and a substrate on which an interconnect pattern is formed, the interconnect pattern facing the electrode and being electrically connected with the electrode. The elastically deformable section is elastically deformed in a manner to be depressed under the electrode, and presses the electrode against the interconnect pattern due to elasticity.
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U.S. Appl. No. 10/828,101, filed Apr. 19, 2004, Hashimoto.
Hogan & Hartson LLP
Owens Douglas W.
Seiko Epson Corporation
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