Electrochemical microsensor package

Details Electrochemical microsensor package Electrochemical microsensor package

2005-02-01

2005-02-01

Noguerola, Alex (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S431000, C156S151000, C156S249000

Reexamination Certificate

active

06849168

ABSTRACT:
An electrochemical microsensor package comprises a substrate matrix having a upper non-conductive layer and an adjacent lower non-conductive layer with a conductive trace or pad extending over an area therebetween. The conductive pad has integral therewith a projecting contact button that projects through and below the second non-conductive for making contact with external electrical contacts. A sensor electrode is positioned on the surface of the conductive pad toward the upper non-conductive layer and in electrical contact therewith. A well extends through the upper non-conductive layer to the upper surface of the electrode. The microsensor packages may be produced by electrodeposition of the conductive pad onto a conductive mandrel having depressions to form the contact button.The microsensor package is fabricated into a microsensor by appropriate adaptation of the well of the microsensor package including applying an appropriate oxide or other layer over the electrode, introduction of an electrolyte or other sensing chemicals into the well and or applying a permeable or impermeable membrane over the top of the well.

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