Integrated circuit assemblies and assembly methods

Details Integrated circuit assemblies and assembly methods Integrated circuit assemblies and assembly methods

2005-08-09

2005-08-09

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S206000, C228S215000

Reexamination Certificate

active

06926190

ABSTRACT:
A method for assembling chips onto substrates includes applying a flux-free, no-flow underfill material. In an embodiment, the method includes removing oxide from interconnects without the use of a flux and applying a flux-free, no-flow underfill. In an embodiment, the method includes removing oxide from bumps, applying no-flow underfill to a substrate, and fluxlessly connecting the bumps to pads on the substrate. In an embodiment, oxide is removed from the bumps by a plasma treatment. In an embodiment, oxide is removed from the bumps by a subjecting the bumps to an oxide reduction process. The assembly of the chips and substrate is free from flux residue and/or flux cleaning solution residue.

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