Pin-assignment method for integrated circuit packages to...

Details Pin-assignment method for integrated circuit packages to... Pin-assignment method for integrated circuit packages to...

2005-02-08

2005-02-08

Zarneke, David A. (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

06852568

ABSTRACT:
A pin-assignment method is provided for use on an IC package to arrange pin connections. The pin-assignment method can allow an improvement in the electro-static discharge (ESD) protection capability for the IC chip packed in the IC package. Specifically, the pin-assignment method organizes the no-connect pins of the IC package into groups and then assigns each of the two pins that bound each no-connect pin group to be connected to a power bus of the IC chip. This allows for an increased ESD protective capability for the no-connect pins. Moreover, the pin-assignment method can simplify the wiring complexity of the IC package.

REFERENCES:
patent: 6107681 (2000-08-01), Lin
patent: 6246113 (2001-06-01), Lin

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