Multilayer printed wiring board and method for producing...

Details Multilayer printed wiring board and method for producing... Multilayer printed wiring board and method for producing...

2005-06-21

2005-06-21

Zarneke, David A. (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S263000

Reexamination Certificate

active

06909054

ABSTRACT:
A multilayer printed circuit board has an IC chip20included in a core substrate30in advance and a transition layer38provided on a pad24of the IC chip20. Due to this, it is possible to electrically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer38made of copper on the die pad24, it is possible to prevent resin residues on the pad24and to improve connection characteristics between the pad24and a via hole60and reliability.

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