Heat sink sheet and fabrication method therefor

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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Reexamination Certificate

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06852573

ABSTRACT:
There is provided a heat sink sheet which can secure a heat source and a heat sink such as an aluminum cooling fin to each other and is superior in heat sink performance. The heat sink sheet is achieved by adhering a pressure sensitive adhesive layer adhered to the whole or part of a surface of a silicone heat sink layer. It is desirable that the pressure sensitive adhesion layer be made of an acrylic-containing adhesive or an urethane-containing adhesive, and a heat sink filler is advantageously blended with the pressure sensitive adhesive layer.

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Bosworth et al., Exceptional Performance from the Development, Qualification and Implementation of a Silicone Adhesive for Bonding Heatsinks to Semiconductor Packages, IEEE Transactions on components, packaging and Manufacturing Technology, Part A, vol. 18, No. 1, Mar. 1995 pp. 94-100.*
The Adhesion Society of Japan, Adhesion Handbook (Third Edition), Nikkankogyoshinbunsya, First Impression of the Third Edition, pp 609-611, 677-683 (Jun. 28, 1996).

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