Copper paste and wiring board using the same

Details Copper paste and wiring board using the same Copper paste and wiring board using the same

2005-02-15

2005-02-15

Stein, Stephen (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S325000, C428S469000, C252S512000, C252S513000, C252S514000, C252S518100

Reexamination Certificate

active

06855399

ABSTRACT:
A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an Fe2O3particle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.

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