Radiation shielding of three dimensional multi-chip modules

Details Radiation shielding of three dimensional multi-chip modules Radiation shielding of three dimensional multi-chip modules

2005-02-22

2005-02-22

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

C361S816000, C257S660000, C250S506100

Reexamination Certificate

active

06858795

ABSTRACT:
The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

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