Method of manufacturing a semiconductor device having a...

Details Method of manufacturing a semiconductor device having a... Method of manufacturing a semiconductor device having a...

2005-06-07

2005-06-07

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000

Reexamination Certificate

active

06902955

ABSTRACT:
Peeling between a molding resin and a substrate is prevented to improve the quality of a semiconductor device. A film substrate capable of being deformed following shrinkage upon curing of a molding resin and having plural partitioned device areas is provided, then a block molding is performed so as to cover the plural device areas in a lump on a chip bearing surface side of the film substrate, and thereafter the film substrate is subjected to dicing wherein a cutting blade is advanced toward a block molding portion to divide the film substrate device area by device area in accordance with a down cutting method, whereby peeling of the substrate in the dicing work can be prevented.

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