Epoxy-acrylate blend pressure-sensitive thermosetting adhesives

Details Epoxy-acrylate blend pressure-sensitive thermosetting adhesives Epoxy-acrylate blend pressure-sensitive thermosetting adhesives

1990-12-21

1992-02-04

McCamish, Marion E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522100, 522103, 522 44, C08F 246

Patent

active

050860887

ABSTRACT:
The invention relates to a pressure-sensitive thermosetting adhesive comprising from about 30% to about 80% by weight of a photopolymerizable prepolymeric or monomeric syrup containing an acrylic ester and a polar copolymerizable monomer, from about 20% to about 60% by weight of an epoxy resin or a mixture of epoxy resins containing no photopolymerizable groups, from about 0.5% to about 10% by weight of a heat-activatable hardener for the epoxy resin, from about 0.01% to about 5% of a photoinitiator, and from 0% to about 5% of a photocrosslinking agent. In a preferred embodiment, imidazoles and thermally expandable thermoplastic microspheres are utilized in the inventive adhesive formulation.

REFERENCES:
patent: 4199646 (1980-04-01), Hori et al.
patent: 4612209 (1986-09-01), Forgo et al.
patent: 4771085 (1988-09-01), Lazardis
patent: 4855170 (1989-08-01), Darvell et al.
patent: 4943461 (1990-07-01), Karim
patent: 4994322 (1991-02-01), Delgado et al.

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