Semiconductor device and method of fabricating the same

Details Semiconductor device and method of fabricating the same Semiconductor device and method of fabricating the same

2005-02-08

2005-02-08

Zarneke, David A. (Department: 2829)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S025000, C438S026000, C438S033000, C438S064000

Reexamination Certificate

active

06852564

ABSTRACT:
A semiconductor device is disclosed which includes a semiconductor chip having a plurality of electrode pads on its upper surface; terminals such as copper posts formed on the upper surface of the semiconductor chip, and electrically connected to each of the electrode pads; a resin deposited on the upper surface of the semiconductor chip, encapsulating the terminals but exposing at least some of them to a predetermined height; and electroconductor members such as solder balls connected to the terminals. There is also disclosed a method of fabricating such a semiconductor device.

REFERENCES:
patent: 5656863 (1997-08-01), Yasunaga et al.
patent: 5672912 (1997-09-01), Aoki et al.
patent: 5757078 (1998-05-01), Matsuda et al.
patent: 6011312 (2000-01-01), Nakazawa et al.
patent: 6147413 (2000-11-01), Farnworth
patent: 6181010 (2001-01-01), Nozawa
patent: 6191487 (2001-02-01), Rodenbeck et al.
patent: 6229209 (2001-05-01), Nakamura et al.
patent: 6262473 (2001-07-01), Hashimoto
patent: 6271588 (2001-08-01), Ohuchi
patent: 6281591 (2001-08-01), Nakamura
patent: 6287893 (2001-09-01), Elenius et al.
patent: 6313532 (2001-11-01), Shimoishizaka et al.
patent: 6335571 (2002-01-01), Capote et al.
patent: 08064725 (1996-03-01), None
patent: 10050772 (1998-02-01), None
patent: 10098045 (1998-04-01), None
patent: 10-359229 (1998-12-01), None
patent: 11-029479 (1999-02-01), None
patent: 11-065157 (1999-11-01), None
“Super CSP: A BGA Type Real Chip Size Package Using a New Encapsulation Method”;Proceeding of the Pan Pacific Microelectronics Symposium; Nikkei Microdevices 1998; pp. 164-166 with partial English Translation.
“Chip Size Package”; Nikkei Microdevices 1998; pp 49-50 with partial translation.
Nikkei Electronics 1999; No. 738; p. 174 and 175.

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