Circuit substrate connecting structure, liquid crystal...

Details Circuit substrate connecting structure, liquid crystal... Circuit substrate connecting structure, liquid crystal...

2005-06-21

2005-06-21

Vu, Phuong T. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S261000, C361S803000

Reexamination Certificate

active

06909053

ABSTRACT:
In connecting a connecting substrate4to a flexible substrate5connected to a terminal portion of one of substrates constituting a liquid crystal display panel through an anisotropic conductive film (ACF)20, a bonding assist member17formed of the same material as that of an internal wiring or a connecting terminal of the connecting substrate and having substantially the same height as that of the connecting terminal is provided between adjacent terminal groups each including a plurality of connecting terminals4bin a terminal forming region of a non-coating portion14in the vicinity of the connecting substrate4, to absorb a difference in height between the terminal groups and the non-coating portion by the bonding assist member17to thereby make the ACF in an intimate contact with the terminal groups as well as the exposed regions uniformly throughout thereof during a temporary press-bonding step of the ACF and prevent a peeling-off and/or breakage of the ACF between the terminal groups and improve the reliability of electrical connection.

REFERENCES:
patent: 5729315 (1998-03-01), Takahashi et al.
patent: 5804882 (1998-09-01), Tsukagoshi et al.
patent: 6528889 (2003-03-01), Matsuhira et al.
patent: 0814510 (1997-12-01), None
patent: 3-120790 (1991-05-01), None

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