Solid-state image pickup apparatus limiting adhesive intrusion

Details Solid-state image pickup apparatus limiting adhesive intrusion Solid-state image pickup apparatus limiting adhesive intrusion

2005-12-20

2005-12-20

Ometz, David L. (Department: 2615)

Television

Camera, system and detail

Optics

C438S106000, C438S108000, C257S778000, C257S787000, C257S792000

Reexamination Certificate

active

06977686

ABSTRACT:
A solid-state image pickup apparatus includes a solid-state image pickup device having a layer of microlenses above a color filter. The solid-state image pickup device is mounted on a side of a flexible printed circuit board by flip-chip bonding, opposite the opening. An adhesive in a gap between the solid-state image pickup device and the flexible printed circuit board strengthens the apparatus. The distance between the edge of the microlens layer and the edge of the flexible printed circuit board defining the opening and nearest to the microlens layer is 2.5 to 10 times wider than the gap between the solid-state image pickup device and the flexible printed circuit board.

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