Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-02-01
2005-02-01
Thompson, Craig A. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
active
06849479
ABSTRACT:
In accordance with the objectives of the invention a new method is provided for ESD protection of mounted flip chips. In a first embodiment of the invention, the Input/Output cells and power cells are provided with ESD protection that is connected to a dedicated bump pad. The substrate of the flip chip package interconnects all of the dedicated bump pads, completing the ESD network. Under the second embodiment of the invention, the Input/Output cells and power cells are provided with ESD protection that is connected to a dedicated bump pad, a last metal layer interconnects all of the dedicated bump pads, completing the ESD network.
REFERENCES:
patent: 5970321 (1999-10-01), Hively
patent: 6078068 (2000-06-01), Tamura
patent: 6144542 (2000-11-01), Ker et al.
patent: 6462423 (2002-10-01), Akram et al.
Taiwan Semiconductor Manufacturing Company
Thompson Craig A.
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