Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate
2005-11-08
2005-11-08
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Alignment marks
C257S666000, C257S670000
Reexamination Certificate
active
06963143
ABSTRACT:
A method and apparatus for aligning a semiconductor device with a corresponding landing site on a carrier substrate. At least two apertures are formed in a semiconductor device, the apertures passing from a first major surface to a second, opposing major surface of the semiconductor device. Corresponding alignment features are provided on the carrier substrate at the landing site to which the semiconductor device is to be mounted. The alignment features are aligned with the corresponding apertures to effect alignment of the semiconductor device. The alignment features may include apertures corresponding in size, shape and arrangement to the semiconductor device apertures. Alignment pins may be placed through the at least two apertures to assist with alignment.
REFERENCES:
patent: 2752580 (1956-06-01), Shewmaker
patent: 3568001 (1971-03-01), Straus
patent: 3678385 (1972-07-01), Bruner
patent: 3882807 (1975-05-01), Montgomery
patent: 3932934 (1976-01-01), Lynch et al.
patent: 4066839 (1978-01-01), Cossutta et al.
patent: 4095253 (1978-06-01), Yoshimura et al.
patent: 4142286 (1979-03-01), Knuth et al.
patent: 4514750 (1985-04-01), Adams
patent: 4528747 (1985-07-01), Hoffman et al.
patent: 4589010 (1986-05-01), Tateno et al.
patent: 4689875 (1987-09-01), Solstad
patent: 4701781 (1987-10-01), Sankhagowit
patent: 4722135 (1988-02-01), Read
patent: 4733462 (1988-03-01), Kawatani
patent: 4744142 (1988-05-01), Bright
patent: 4801997 (1989-01-01), Ono et al.
patent: 4810154 (1989-03-01), Klemmer et al.
patent: 4829665 (1989-05-01), Kabeshita et al.
patent: 4841100 (1989-06-01), Ignasiak
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 4958214 (1990-09-01), Ries et al.
patent: 4961107 (1990-10-01), Geist et al.
patent: 4967262 (1990-10-01), Farnsworth
patent: 4975079 (1990-12-01), Beaman et al.
patent: 4985107 (1991-01-01), Conroy et al.
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5034802 (1991-07-01), Liebes, Jr. et al.
patent: 5051339 (1991-09-01), Friedrich et al.
patent: 5051813 (1991-09-01), Schneider et al.
patent: 5056216 (1991-10-01), Madou et al.
patent: 5074036 (1991-12-01), Dunaway et al.
patent: 5114880 (1992-05-01), Lin
patent: 5117330 (1992-05-01), Miazga
patent: 5150194 (1992-09-01), Brooks et al.
patent: 5155905 (1992-10-01), Miller, Jr.
patent: 5164818 (1992-11-01), Blum et al.
patent: 5189507 (1993-02-01), Carlomagno et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5228862 (1993-07-01), Baumberger et al.
patent: 5236118 (1993-08-01), Bower et al.
patent: 5255431 (1993-10-01), Burdick
patent: 5313015 (1994-05-01), Hoge
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5337219 (1994-08-01), Carr et al.
patent: 5349235 (1994-09-01), Lee et al.
patent: 5349236 (1994-09-01), Oshino et al.
patent: 5350713 (1994-09-01), Liang
patent: 5352851 (1994-10-01), Wallace et al.
patent: 5369550 (1994-11-01), Kwon
patent: 5376010 (1994-12-01), Petersen
patent: 5378924 (1995-01-01), Liang
patent: 5400220 (1995-03-01), Swamy
patent: 5403671 (1995-04-01), Holzmann
patent: 5413970 (1995-05-01), Russell
patent: 5426405 (1995-06-01), Miller et al.
patent: 5435482 (1995-07-01), Variot et al.
patent: 5435732 (1995-07-01), Angulas et al.
patent: 5442852 (1995-08-01), Danner
patent: 5446960 (1995-09-01), Isaacs et al.
patent: 5453581 (1995-09-01), Liebman et al.
patent: 5459287 (1995-10-01), Swamy
patent: 5463191 (1995-10-01), Bell et al.
patent: 5468991 (1995-11-01), Lee et al.
patent: 5477086 (1995-12-01), Rostoker et al.
patent: 5477933 (1995-12-01), Nguyen
patent: 5521427 (1996-05-01), Chia et al.
patent: 5521428 (1996-05-01), Hollingsworth et al.
patent: 5526974 (1996-06-01), Gordon et al.
patent: 5528461 (1996-06-01), Gore et al.
patent: 5530291 (1996-06-01), Chan et al.
patent: 5530295 (1996-06-01), Mehr
patent: 5555488 (1996-09-01), McLellan et al.
patent: 5556293 (1996-09-01), Pfaff
patent: 5578870 (1996-11-01), Farnsworth et al.
patent: 5611705 (1997-03-01), Pfaff
patent: 5637008 (1997-06-01), Kozel
patent: 5637919 (1997-06-01), Grabbe
patent: 5639323 (1997-06-01), Jordan
patent: 5643835 (1997-07-01), Chia et al.
patent: 5646447 (1997-07-01), Ramsey et al.
patent: 5669774 (1997-09-01), Grabbe
patent: 5688127 (1997-11-01), Staab et al.
patent: 5690504 (1997-11-01), Scanlan et al.
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5702255 (1997-12-01), Murphy et al.
patent: 5714792 (1998-02-01), Przano
patent: 5716222 (1998-02-01), Murphy
patent: 5726502 (1998-03-01), Beddingfield
patent: 5728601 (1998-03-01), Sato et al.
patent: 5730606 (1998-03-01), Sinclair
patent: 5751556 (1998-05-01), Butler et al.
patent: 5761036 (1998-06-01), Hopfer et al.
patent: 5766978 (1998-06-01), Johnson
patent: 5767580 (1998-06-01), Rostoker
patent: 5770891 (1998-06-01), Frankeny et al.
patent: 5773321 (1998-06-01), Ishikawa et al.
patent: 5793618 (1998-08-01), Chan et al.
patent: 5796590 (1998-08-01), Klein
patent: 5797177 (1998-08-01), Simmons et al.
patent: 5805427 (1998-09-01), Hoffman
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5829988 (1998-11-01), McMillan et al.
patent: 5861654 (1999-01-01), Johnson
patent: 5861669 (1999-01-01), Sono et al.
patent: 5887344 (1999-03-01), Sinclair
patent: 5892245 (1999-04-01), Hilton
patent: 5895554 (1999-04-01), Gordon
patent: RE36217 (1999-06-01), Petersen
patent: 5924622 (1999-07-01), Davis et al.
patent: 5930889 (1999-08-01), Klein
patent: 5936849 (1999-08-01), Fetterman
patent: 5947751 (1999-09-01), Massingill
patent: 5949137 (1999-09-01), Domadia et al.
patent: 5955888 (1999-09-01), Frederickson et al.
patent: 5978229 (1999-11-01), Kim
patent: 5982027 (1999-11-01), Corisis
patent: 5983477 (1999-11-01), Jacks et al.
patent: 5987742 (1999-11-01), Acciai et al.
patent: 5988885 (1999-11-01), Heshmat
patent: 6007357 (1999-12-01), Perino et al.
patent: 6018249 (2000-01-01), Akram et al.
patent: 6026566 (2000-02-01), Urban et al.
patent: 6028350 (2000-02-01), Sabyeying
patent: 6036503 (2000-03-01), Tsuchida
patent: 6037667 (2000-03-01), Hembree et al.
patent: 6040618 (2000-03-01), Akram
patent: 6042387 (2000-03-01), Jonaidi
patent: 6048744 (2000-04-01), Corsis et al.
patent: 6084781 (2000-07-01), Klein
patent: 6169323 (2001-01-01), Sakamoto
patent: 6198172 (2001-03-01), King et al.
patent: 6242817 (2001-06-01), Grande et al.
patent: 6297960 (2001-10-01), Moden et al.
patent: 6333638 (2001-12-01), Fukasawa et al.
patent: 6384360 (2002-05-01), Masuo et al.
patent: 6389688 (2002-05-01), Srivastava et al.
patent: 6420195 (2002-07-01), King et al.
patent: 6518098 (2003-02-01), Corisis
patent: 6548827 (2003-04-01), Irie
patent: 6561836 (2003-05-01), Marshall et al.
patent: 2001/0046127 (2001-11-01), Matsumura
patent: 07-302860 (1995-11-01), None
Karl J. Puttlitz et al.,C-4/CBGA Comparison with Other MLC Single Chip Package Alternatives, IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B, vol. 18, No. 2, May 1995, pp. 250-256.
Lewis S. Goldmann,Statistical Model for the Inherent Tilt of Flip-Chips, Trasnsactions of the ASME, vol. 118, Mar. 1996, pp. 16-20.
Patrick J. Nasiatka et al.,Determination of Optical Solder Volume for Precision Self-Alignment of BGA using Flip-Chip Bonding, Department of Electrical and Electronic Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong.
Ha Nathan W.
Micro)n Technology, Inc.
Pham Hoai
TraskBritt PC
LandOfFree
Method of ball grid array (BGA) alignment, method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of ball grid array (BGA) alignment, method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of ball grid array (BGA) alignment, method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3472558