Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate
2005-08-02
2005-08-02
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
C257S720000, C257S717000, C257S713000, C257S678000, C257S788000
Reexamination Certificate
active
06924559
ABSTRACT:
The invention relates to the field of electronic devices with a thermally conducting encapsulant for draining away some of the energy dissipated by the electronic components contained in the electronic device. This is an electronic device comprising: a circuit (7) on which several electronic components (8) able to dissipate energy are placed; a thermal conducting cover (1) located opposite the circuit (7); a thermally conducting encapsulant (4) placed between the circuit (7) and the cover (1) so as to ensure heat transfer, by conduction toward the cover (1), of the energy dissipated in the components (8); the respective surfaces of the encapsulant (4) and of the cover (1) which are facing each other including a number of substantially complementary recesses (3, 6) and projections (2, 5) allowing the cover (1) to fit into the encapsulant (4), and gaps (j1, j2) being left between the recesses (3, 6) and the projections (2, 5) so as, on the one hand, to reduce the stress exerted by the cover (1) on the encapsulant (4) in the direction of the circuit (7) and on the other hand, to maintain the thermal conduction between the encapsulant (4) and the cover (1) above a given conduction threshold.The invention can be applied in particular to digital electronic cards.
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Dupin Catherine
Guiragossian Nicolas
Venencie Christophe
Flynn Nathan J.
Lowe Hauptman & Berner LLP
Mandala Jr. Victor A.
Thales
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