Method of forming a structure for supporting an integrated...

Details Method of forming a structure for supporting an integrated... Method of forming a structure for supporting an integrated...

2005-08-02

2005-08-02

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S057000, C257S422000, C257S660000, C361S739000, C361S818000

Reexamination Certificate

active

06924168

ABSTRACT:
A method and apparatus which provide one or more electromagnetic shield layers for integrated circuit chips containing electromagnetic circuit elements are disclosed. The shield layers may be in contact with the integrated circuit chip, including magnetic memory structures such as MRAMs, or in a flip-chip carrier, or both. A printed circuit board which supports the chip may also have one or more shield layers.

REFERENCES:
patent: 3743978 (1973-07-01), Fritz
patent: 4408255 (1983-10-01), Adkins
patent: 4656499 (1987-04-01), Butt
patent: 4801489 (1989-01-01), Nakagawa et al.
patent: 5288238 (1994-02-01), Ikenaka et al.
patent: 5352925 (1994-10-01), Sudoh et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5406117 (1995-04-01), Dlugokecki et al.
patent: 5436203 (1995-07-01), Lin
patent: 5490786 (1996-02-01), Mosquera et al.
patent: 5639989 (1997-06-01), Higgins, III
patent: 5689878 (1997-11-01), Dahringer et al.
patent: 5902690 (1999-05-01), Tracy et al.
patent: 5939772 (1999-08-01), Hurst et al.
patent: 5949654 (1999-09-01), Fukuoka

Affiliated with

Also associated with

Rating

Method of forming a structure for supporting an integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a structure for supporting an integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a structure for supporting an integrated... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3467988