Methods of forming semiconductor stacked die devices

Details Methods of forming semiconductor stacked die devices Methods of forming semiconductor stacked die devices

2005-06-07

2005-06-07

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S118000, C438S119000

Reexamination Certificate

active

06902953

ABSTRACT:
Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, a method comprises forming at least one conductive structure within a plurality of semiconductor substrates, said act of forming comprising first forming said at least one conductive structure to extend into a respective semiconductor substrate a distance that is less than an elevational thickness of the substrate, and second removing substrate material elevationally adjacent said one conductive structure effective to expose a surface of said one conductive structure, at least portions of one of the conductive structures having oppositely facing, exposed outer surfaces; and stacking individual substrates together such that individual conductive structures on each substrate are in electrical contact with the conductive structures on a next adjacent substrate.

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