Method of forming electrode for saw device

Etching a substrate: processes – Forming or treating optical article

Reexamination Certificate

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C216S032000, C216S067000, C216S077000, C438S712000, C204S192350

Reexamination Certificate

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06908562

ABSTRACT:
A method of forming an electrode for a surface acoustic wave (SAW) device comprises the steps of forming an alloy film (32) made of aluminum (Al) and magnesium (Mg) on a substrate (31) and selectively etching the alloy film (32) by using a gaseous mixture composed of BCl3, Cl2, and N2 to form the electrode such that the electrode has at least one sidewall polymer film (33). The method controls the production of hillocks and voids to provide high withstand voltage.

REFERENCES:
patent: 4294672 (1981-10-01), Ohba et al.
patent: 4615908 (1986-10-01), Behn et al.
patent: 5106471 (1992-04-01), Galvin et al.
patent: 6204190 (2001-03-01), Koshido
patent: 6526996 (2003-03-01), Chang et al.

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