Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2005-02-01
2005-02-01
Smith, Matthew (Department: 2825)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S700000, C257S701000, C257S690000, C257S707000, C257S717000, C257S724000, C257S778000, C438S110000, C438S112000, C438S121000, C438S122000, C438S113000, C438S612000
Reexamination Certificate
active
06849935
ABSTRACT:
An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.
REFERENCES:
patent: 5729896 (1998-03-01), Dalal et al.
patent: 5880705 (1999-03-01), Onyskevych et al.
patent: 5929562 (1999-07-01), Pichler
patent: 6066512 (2000-05-01), Hashimoto
patent: 6252564 (2001-06-01), Albert et al.
patent: 6271598 (2001-08-01), Vindasius et al.
patent: 6274978 (2001-08-01), Roach et al.
patent: 6370019 (2002-04-01), Matthies et al.
patent: 6373142 (2002-04-01), Hoang
patent: 6410415 (2002-06-01), Estes et al.
patent: 6498592 (2002-12-01), Matthies
patent: 6541919 (2003-04-01), Roach et al.
patent: 20020008463 (2002-01-01), Roach
patent: 20030011300 (2003-01-01), Palanisamy et al.
patent: 20030011302 (2003-01-01), Palanisamy
patent: WO 9941732 (1999-08-01), None
Burke William J.
Sarnoff Corporation
Smith Matthew
Yevsikov Victor V
LandOfFree
Low-cost circuit board materials and processes for area... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low-cost circuit board materials and processes for area..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low-cost circuit board materials and processes for area... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3461351