Method of using a soft subpad for chemical mechanical polishing

Details Method of using a soft subpad for chemical mechanical polishing Method of using a soft subpad for chemical mechanical polishing

Filed on

2005-06-21

Date issued

2005-06-21

Examiner

Nguyen, Dung Van (Department: 3723)

Patent Class

Abrading

SubClass

Abrading process

SubSubClass

Glass or stone abrading

Other Related Categories

C451S057000

Type

Reexamination Certificate

Status

active

Patent number

06908366

Description

ABSTRACT:
The present invention is directed to a method of modifying a wafer surface comprising providing a first abrasive article comprising a first three-dimensional fixed abrasive element and a first subpad generally coextensive with the first fixed abrasive element, contacting a surface of the first three-dimensional fixed abrasive element with a wafer surface, and relatively moving the first abrasive article and the wafer. The method additionally provides providing a second abrasive article comprising a second three-dimensional fixed abrasive element and a second subpad generally coextensive with the second fixed abrasive element, contacting a surface of the second three-dimensional fixed abrasive element with the wafer surface, and relatively moving the second abrasive article and the wafer. Wherein the first subpad has a deflection less than the deflection of the second subpad when measured 1.5 cm from the edge of a 1 kg weight, the weight having a contact area of 1.9 cm diameter.

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