Intermediate structures in porous substrates in which...

Active solid-state devices (e.g. – transistors – solid-state diode – Miscellaneous

Reexamination Certificate

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C257S009000, C257S014000, C257S029000, C257S030000, C438S409000

Reexamination Certificate

active

06952055

ABSTRACT:
The invention is a method of fabricating electrically passive components or optical elements on top or underneath of an integrated circuit by using a porous substrate that is locally filled with electrically conducting, light emitting, insulating or optically diffracting materials. The invention is directed to a method of fabricating electrically passive components like inductors, capacitors, interconnects and resistors or optical elements like light emitters, waveguides, optical switches of filters on top or underneath of an integrated circuit by using porous material layer that is locally filled with electrically conducting, light emitting, insulating or optically diffracting materials. In the illustrated embodiment the fabrication of voluminous, solenoid-type inductive elements in a porous insulating material by standard back- and front-side-lithography and contacting these two layers by electroplating micro-vias through the pores is described. By using a very dense interconnect spacing, an inter-pore capacitor structure is obtained between the metalized pores and the pore walls utilized as insulators.

REFERENCES:
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patent: 5581091 (1996-12-01), Moskovits et al.
patent: 5670411 (1997-09-01), Yonehara et al.
patent: 5847327 (1998-12-01), Fischer et al.
patent: 6110393 (2000-08-01), Simmons et al.
patent: 6127250 (2000-10-01), Sylvester et al.
patent: 6331493 (2001-12-01), Sharan
patent: 6359288 (2002-03-01), Ying et al.

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