System for chemical mechanical polishing comprising an...

Abrading – Abrading process – With tool treating or forming

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S021000, C451S445000, C451S444000, C451S072000, C451S443000

Reexamination Certificate

active

06929536

ABSTRACT:
A system and method for chemical mechanical polishing of a substrate is disclosed in which a polishing pad is conditioned by directing a fluid jet to the surface of the polishing pad. Thus, the use of expensive consumables, like conditioning pads comprising diamonds, can be avoided. Furthermore, the risk of substrates being scratched by diamonds lost from the conditioning pad is avoided.

REFERENCES:
patent: 5154021 (1992-10-01), Bombardier et al.
patent: 5716264 (1998-02-01), Kimura et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5782799 (1998-07-01), Jacobsen et al.
patent: 5902173 (1999-05-01), Tanaka
patent: 5957757 (1999-09-01), Berman
patent: 6168502 (2001-01-01), Allman et al.
patent: 6258166 (2001-07-01), Leon et al.
patent: 6306012 (2001-10-01), Sabde
patent: 6443816 (2002-09-01), Inoue et al.
patent: 6579799 (2003-06-01), Chopra et al.
patent: 6764389 (2004-07-01), Butterfield et al.
patent: 6769968 (2004-08-01), So
patent: 6773332 (2004-08-01), Moore
patent: 2 360 725 (2001-10-01), None
patent: WO 99/50024 (1999-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System for chemical mechanical polishing comprising an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for chemical mechanical polishing comprising an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for chemical mechanical polishing comprising an... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3457400

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.