Optical semiconductor housing and method for making same

Details Optical semiconductor housing and method for making same Optical semiconductor housing and method for making same

2005-11-29

2005-11-29

Smoot, Stephen W. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S680000, C257S704000, C257S723000, C257S738000, C257S777000, C438S059000, C438S065000, C438S116000

Reexamination Certificate

active

06969898

ABSTRACT:
Optical semiconductor package and its fabrication process, in which: a rear face of a first semiconductor component (3) such as a microprocessor is supported by a front face of an electrical connection support plate (1); a rear face of a second semiconductor component (11) is fixed to a front face of the said first component (3) and a front face of this second component has an optical sensor (13); first electrical connection means (6) connect the said first component to the front face of the said support plate; second electrical connection means (14) connect the said second component to the front face of the said support plate; means (17) ensure encapsulation of the said components stacked on the said support plate and of the said electrical connection means, the said encapsulation means being made from a transparent material which is opposite the said optical sensor; and external electrical connection means (24) are located on an exposed part of the said support plate.

REFERENCES:
patent: 5436492 (1995-07-01), Yamanaka
patent: 5932875 (1999-08-01), Chung et al.
patent: 6429047 (2002-08-01), Huang
patent: 6649991 (2003-11-01), Chen et al.
patent: 6686667 (2004-02-01), Chen et al.
patent: 2002/0096729 (2002-07-01), Tu et al.
patent: 11261044 (1999-09-01), None
Nishida et al., “Semiconductor Device with Solid-State Image Sensing Element and Manufacture of this Semiconductor Device,” English translation of Japanese patent application publication No. JP 11-261044 A, Sep. 1999.

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