Semiconductor device package

Details Semiconductor device package Semiconductor device package

2005-05-31

2005-05-31

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S680000, C438S106000, C438S121000

Reexamination Certificate

active

06900526

ABSTRACT:
A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.

REFERENCES:
patent: 4805009 (1989-02-01), Pryor et al.
patent: 5150196 (1992-09-01), Yamamoto et al.
patent: 5268533 (1993-12-01), Kovacs et al.
patent: 5723904 (1998-03-01), Shiga
patent: 5786548 (1998-07-01), Fanucchi et al.
patent: 6257400 (2001-07-01), Woodhouse
patent: 6597060 (2003-07-01), Okada et al.

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