Metal gate electrode using silicidation and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – With base region having specified doping concentration...

Reexamination Certificate

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C257S412000

Reexamination Certificate

active

06873030

ABSTRACT:
A semiconductor device is fabricated by providing a substrate, and providing a dielectric layer on the substrate. A polysilicon body is formed on the dielectric layer, and a metal layer is provided on the polysilicon body. A silicidation process is undertaken to silicidize substantially the entire polysilicon body to form a gate on the dielectric. In an alternative process, a cap layer is provided on the polysilicon body, which cap layer is removed prior to the silicidation process. The polysilicon body is doped with a chosen specie prior to the silicidation process, which dopant, during the silicidation process, is driven toward the dielectric layer to form a gate portion having a high concentration thereof adjacent the dielectric, the type and concentration of this specie being instrumental in determining the work function of the formed gate.

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